Wafer-Level Assembly of Heterogeneous Technologies
نویسندگان
چکیده
A technology platform demonstrating wafer-level assembly of heterogeneous technologies based upon vertical wafer stacking is described. This platform offers the potential for low-cost assembly of various compound semiconductor circuits with silicon ICs for wide bandwidth optoelectronic and spaceconservative packaging applications. Process development results obtained to date are presented, and approaches to heterogeneous integration using this novel technology platform are outlined.
منابع مشابه
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
Plasmaand water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapo...
متن کاملVia-First Inter-Wafer Vertical Interconnects utilizing Wafer-Bonding of Damascene-Patterned Metal/Adhesive Redistribution Layers
Three-dimensional (3D) integration with through-die vias offer improved electrical performance compared to edgeconnected wire bonds in stacked-die assemblies. Monolithic wafer-level 3D integration offers the potential for a high density of micron-sized through-die vias necessary for highest performance of integrated systems. In addition, such wafer-level technologies offer the potential of lowe...
متن کاملHeterogeneous material integration for MEMS
This thesis describes heterogeneous integration methods for the fabrication of microelectromechanical systems (MEMS). Most MEMS devices reuse the fabrication techniques that are found in the microelectronics integrated circuit industry. This limits the selection of materials and processes that are feasible for the realization of MEMS devices. Heterogeneous integration methods, on the other hand...
متن کاملLow-Temperature Bonding for Silicon-Based Micro-Optical Systems
Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts th...
متن کاملA Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping
Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications based on Flip Chip on Board or Flip Chip in Package. The first driving force for the introduction of this Technology was the need to achieve increased speed and performance along with higher I/O count. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is...
متن کامل